Laserx offers D/B and W/B equipment, with for high precision, high degree of automation, core technology is self-controlled, high cost-effectiveness. And we currently developing advanced 2.5D/3D packaging solutions for photonic devices.
High precision
• XY placement accuracy ±3-5μm, die rotation accuracy ±0.3°
High degree of automation
• Multi-functional feeding mode
• Stable bonding force control
• Tension detection to ensure product quality
• Compatible with MES Interface
• Highly flexible software system
Core technology is self-controlled
• Ultrasonic control, motion control, optics system
Shenzhen Headquarters：Building 3, Yufengda Industrial Park, Guangming District, Shenzhen City, Guangdong Province, China
Reception Service Number：0755-23019639
Consultation Email：hongbin.ding@laserx.net & laserx.xs@laserx.net
About LaserxCompany ProfileDevelopment HistoryCompany CultureHonor and Qualification
ProductsBurn-in And TesterOptical AlignmentSemiconductor PackagingChip TesterHigh precision linear and goniometer slide
SolutionOne-stop Solution for Photonic PackagingPhotonic Assembly and AlignmentIndustrial Laser Burn-in And TesterAdvanced packaging
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