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Semiconductor Packaging

Burn-in And TesterOptical AlignmentSemiconductor PackagingChip TesterHigh precision linear and goniometer slide

Semiconductor Packaging

Ultrasonic Wire Bonder

Product Feature

• Long gantry XY axis for large working area
• Bond quality control and assessment
• Direct drive linear motor and flying vision systems improve efficiency
• Quickly change of ultrasonic bond head supports aluminum wire, aluminum ribbon and copper wire bonding

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Product Parameter

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Shenzhen Headquarters:Building 3, Yufengda Industrial Park, Guangming District, Shenzhen City, Guangdong Province, China

Reception Service Number:0755-23019639

Consultation Email:hongbin.ding@laserx.net & laserx.xs@laserx.net