Semiconductor Packaging
Semi-auto Eutectic Die bonder
Product Feature
• Placement accuracy of ± 1.5 μm(3σ)
• Ability to handle tiny chips
• Apply LD and Submount cocrystal welding
Download
• Placement accuracy of ± 1.5 μm(3σ)
• Ability to handle tiny chips
• Apply LD and Submount cocrystal welding
Download
Shenzhen Headquarters：Building 3, Yufengda Industrial Park, Guangming District, Shenzhen City, Guangdong Province, China
Reception Service Number：0755-23019639
Consultation Email：hongbin.ding@laserx.net & laserx.xs@laserx.net
About LaserxCompany ProfileDevelopment HistoryCompany CultureHonor and Qualification
ProductsBurn-in And TesterOptical AlignmentSemiconductor PackagingChip TesterHigh precision linear and goniometer slide
SolutionOne-stop Solution for Photonic PackagingPhotonic Assembly and AlignmentIndustrial Laser Burn-in And TesterAdvanced packaging
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